Ç㹫¿µ, ¹ÚÁ¾Ã¶, À̼öÅ ȸ¿ø- Interpretation of Hot Rolling and Cold Rolling Texture in High Purity Aluminium
Ç㳲ȸ ȸ¿ø- Grain Boundary and Intergranular Fracture in Ferrite Containing Mo, Si or Al
ÀÌÀçÇö, ÃÖ½ÂÁÖ, ¹ÚÀå½Ä ȸ¿ø- Electron Channeling Pattern¿¡ ÀÇÇÑ Ni3Al°áÁ¤¸³ÀÇ ¿¡Äª Ư¼º¿¬±¸
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ÀÌÅÂÈ£, ÀÌâ±æ, ¿Àâ¼®, ±è¼ºÁØ, ÃÖº´ÇРȸ¿ø, Fe-0.15C-1.5Mn-1.5Si-1.0Cu Çձݿ¡¼ 9R ¼®Ãâ»óÀÇ °áÁ¤ÇÐÀû Ư¼º(I),(II)
±èÇö¿ì ȸ¿ø -Characteristics of Ru Etching Using O2/Cl2 Plasmas
¹Ú¿ë¼ö, ±è¼øÅÂ, ÀÌÀμº, ¼ÛÄ¡º¹ ȸ¿ø- Effects of Rare Earth Metals Addition and Aging Treatment on the Corrosion Resistance and Mechanical Properties of Super Duplex Stainless Steels
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2004³â
À̵¿±Ù, À̼ºÇРȸ¿ø- ÀÌÁßÁ¶Á÷À» °¡Áö´Â Ti-6Al-4V ÇÕ±ÝÀÇ ÁØÁ¤Àû ¹× µ¿Àû º¯Çü °Åµ¿¿¡ ¹ÌÄ¡´Â¥á2-Ti3Al ¼®ÃâÀÇ ¿µÇâ
ÀÌÀçö, ½ÉÀçÇõ, ÀÌÈ£ÀΠȸ¿ø- Interfacial Reaction in ASZ/A384 Al Composite and Its Influence on Mechanical Properties
À̵¿Èñ ±Çµ¿ÀÏ È¸¿ø- ³ª³ë ¾ÐÀÔ°î¼±ÀÇ Åº¼ºÇؼ®°ú pile-up °Åµ¿ ¿¹ÃøÀ» ÅëÇÑ (100) ÅÖ½ºÅÙ ´Ü°áÁ¤ÀÇ Åº¼º°è¼ö ¹× °æµµ Æò°¡
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2005³â
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¹Ú¿µ¹è, ÀüÀμö ȸ¿ø - ´ÙÃþ¹è¼± ºñ¾Æ ±¸Á¶¿¡ ´ëÇÑ ÀÀ·Â°ú Electromigration Çؼ®
À±ÀçÈ«, ±èÇö¼ö, ÇÑÁÖÈñ, B. D. Mitton, R. M. Latanision, ±è¿µ½Ä ȸ¿ø - Influence of Chromizing Treatment on Corrosion Behavior of AISI 316 Stainless Steel in a Supercritical Water Oxidation
±èÀ¯Âù, Eric Fleury, ±è±â¹è, ÀÌÀçö, ¼ºµµ¼ö, ±Ç¿ÀÁý, ±èµµÇâ ȸ¿ø - Enhancement of the Glass Forming Ability of Cu-Zr-Al alloys by Ag Addition
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2006³â
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±è¼ö¿µ, ÀÌÁ¾¶÷ ȸ¿ø - High-Performance Organic Light Emitting Diodes Fabricated with a Ruthenium Oxide Hole Injection Layer
±è¿µ¼® ȸ¿ø - Driving Force for Delayed Hydride Cracking of Zirconium Alloys
³ë¸íÈÆ, ±è¿µ¿í, ±è¿øÁß, Toshiyuki Nishimura, ¼¿ø¼±, °í½ÅÀÏ, ÀÌ»óÁø ȸ¿ø - Effect of Aluminum Nitride-Scandia Content on the Microstructural and Mechanical Properties of Sintered Silicon Carbide Ceramics (MMI)
ÀÌÁö¿µ, Çѱæ¼ö, ±èÀ¯Âù, º¯Áö¿µ, ÀåÀçÀÏ, ¼®Çö±¤, ¾ç¼®Á¶ ȸ¿ø - Effects of Impurities on the Biodegradation Behavior of Pure Magnesium (MMI)
È«¼ºÈÆ, ¹èº´ÁÖ, ¾ç±â¿¬, Á¤ÁØÈ£, ±èÇü¼®, ÀÌÇå ȸ¿ø - Fabrication of Sub-50 nm Au Nanowires using Thermally Curing Nanoimprint Lithography [EML]
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2011³â
Á¶¿µ»ó, È«Á¤Áø, ±è¿µ±¹, Á¤±¹Ã¤, ÃÖöÁø ȸ¿ø - Synthesis and Dispersion Stabilization of Indium Tin Oxide Nanopowders by Coprecipitation and Sol-Gel Method for Transparent and Conductive Films(´ëÇѱݼӷÀç·áÇÐȸÁö)
Çѽ¿À, ÇÑâ¼® ȸ¿ø - A Study on the Creep Strength of L12 and B2-ordered Intermetallics(´ëÇѱݼӤýÀç·áÇÐȸÁö)
±è¹Î¿í, ±èµµÇâ, ÇѽÂÈñ, Eric Fleury, ¼®Çö±¤, Â÷ÇÊ·É, ±èÀ¯Âù ȸ¿ø - Surface modification by carbon ion implantation for the application of Ni-based amorphous alloys as bipolar plate in proton exchange membrane fuel cell (MMI)
ÇÑÁØÈñ, ¼Û±â¾È, ¹ÚÀº¹Ì, À̼öÈ«, ¹ÚÁØ¿µ, ¼¿ëÈ£, À̳»¼º, ÀÌ¿øÈñ, ±è±â¹ü ȸ¿ø - Effect of Microstructure Modulation on Mechanical Properties of Ti-Fe-Sn Ultrafine Eutectic Composites (MMI)
À±µ¿±Ô, À±¿ì¿µ ȸ¿ø - Electrochemical Behavior of a Silicon Particle Anode Cell Synthesized by an Induction Furnace (EML)
ÃÖ»óÁØ, ¾ç¿ì¿µ, ±è±âÈ«, °æ¿ë±¸, Á¤Àç°ü, ¹èÇüÁø, ¹ÚÁÖö, ±è°æ±¹, ÀÌ»óºó, Á¶¼öÇà ȸ¿ø - Resistive Switching Property of Copper Sulfide and its Dependence on Electrode (EML)