프로그램
세션 트랙
4월 28일 (목요일)
전산1
전산재료과학
좌장 : 김형준(한국과학기술원(KAIST)) 09:00-10:35
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전산1-1
09:00
Molecular dynamics simulation study on the origin of exceptional work-hardening behavior of BMG-SMA composites
고원석* (인하대학교), 오현석 (Massachusetts Institute of Technology), 박은수 (서울대학교)
전산1-2
09:25
Effects of grain boundary segregation and solute clustering on grain boundary migration and recrystallization behavior of Mg-Al-Zn and Mg-Zn-Ca alloys
장효선* (한국재료연구원), 이병주 (포항공과대학교)
전산1-3학생구두발표
09:50
Atomistic Simulations for Hydrogen effect on Crack Fatigue Behavior in Type 316 Stainless alloy
Hakjun Lee and Hojin Ryu* (Korea Advanced Institute of Science and Technology (KAIST))
전산1-4학생구두발표
10:05
Validation of thermodynamic models for predicting hydrogen segregation at grain boundaries in nickel
Sojeong Yang and Takuji Oda* (Seoul National Univ.)
전산1-5학생구두발표
10:20
Thermodynamic reevaluation of Ag-Cu nanoscale phase diagram
Bo Jin (Korea University, Korea, Central South University, China), Joonho Lee* (Korea University, Korea), Shuhong Liu, and Yong Du (Central South University, China)
4월 28일 (목요일)
전산2
전산재료과학
좌장 : 장효선(한국재료연구원) 10:45-12:00
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화상강의실 비밀번호는 kim2022입니다
전산2-1학생구두발표
10:45
제일원리계산과 기계학습으로 고엔트로피 합금 내 석출물을 정확하고 효율적으로 예측하는 방법
도경연, 김선규, 김신현, 이동화* (포항공과대학교)
전산2-2학생구두발표
11:00
Defect Formation Energy in Metal Uranium by Machine Learning Potential: a Molecular Dynamics Study
Jae-Hyuk Kim and Takuji Oda* (Seoul National University)
전산2-3학생구두발표
11:15
Development of Machine Learning Potential Model for Li2TiO3
Donggyu Lee and Takuji Oda* (Seoul National Univ.)
전산2-4학생구두발표
11:30
Computational analysis on quantum diffusivity of hydrogen in bcc iron: Application of machine learning interatomic potential
Hyukjoon Kwon and Takuji Oda* (Seoul National University)
전산2-5학생구두발표
11:45
Development of a universal descriptor for dielectric materials with an artificial intelligence
Se-Jun Kim (Korea Advanced Institute of Science and Technology), Won June Kim* (Changwon National University), Eok-Kyun Lee*, and Hyungjun Kim* (Korea Advanced Institute of Science and Technology)